Huawei is holding a keynote address tomorrow (September 2nd) at IFA in Berlin, during which it is expected that Richard Yu, the CEO of Huawei Consumer Business Group, will announce the OEM’s next flagship System-on-a-Chip, the Kirin 970.
Although Huawei hasn’t yet officially released the details of the Kirin 970, the folks over at AnandTech spotted an exhibit on the IFA show floor all about the new processor. According to the notice on the exhibit, the Kirin 970 is built by TSMC using its 10m process. It is an octa-core processor, with a 12-core GPU, dual-ISP, and a high speed Cat 18. LTE modem.
There is also a dedicated AI computing unit, something that Yu had previously hinted about on several different occasions during the run-up to the show. The new AI unit will deliver 25x the performance, compared to similar CPU based AI workloads, with 50x more power efficiency. The idea is that smartphones using the Kirin 970 will be able to offer real time image recognition, voice interaction, and intelligent photography, all while using less power.
Although the internal specifics of the SoC haven’t been released, the rumor is that the octa-core CPU used is similar as the Kirin 960, with four ARM Cortex-A73 cores and four ARM Cortex-A53 cores, clocked at 2.4 GHz and 1.8 GHz respectively. The 12-core GPU is expected to be the Mali-G72, the latest GPU from ARM, which was announced earlier this year along with the Coretx-A55 and the Cortex-A75.
The dual-ISP offers motion detection, low light photography enhancements, and support for HDR10 with 4K60 decoding, 4K30 encoding.
Stay tuned for more information once Huawei officially announces the Kirin 970 tomorrow. Until then, please let me know in the comments below if you are looking forward to the Kirin 970 and Huawei devices built around it?