Sources from Korea and the US are suggesting that Qualcomm’s high-end Snapdragon 810 mobile SoC is facing overheating issues which may delay production.
2015 will see a large number of mobile SoCs finally reach 20nm and beyond. We examine how far mobile SoCs have come and what to expect in the coming years from a process size perspective.
TSMC has announced that it has already entered risk production for its 16nm FinFET Plus process and is planning to produce integrated CMOS MEMS packages for future tech products.
ARM and TSMC have announced an agreement to work towards bringing the 64-bit ARMv8-A processor IP to a 10FinFET manufacturing process.
Who will make the processor for the iPhone 6? Due to Apple’s bitter-sweet relationship with Samsung the Cupertino company is looking to shift some of its chip manufacturing to TSMC.
According to a report from the Korea Economic Daily, Samsung is set to pair back up with Apple in order to supply 14nm Apple A9 chips for a next generation iPhone, which should be released sometime in 2015.
With 20nm processors expected to land in 2014, TSMC has stated that performance could be up 30%, whilst improving energy efficiency by 25%.
TSMC will make some of the chips going into Apple’s products starting with 2014. But Samsung will still provide Apple with processors in 2014, as well as displays and memory modules.
ARM and TSMC have issued a press released stating that the new Cortex-A57 chip has reached the “tape out” stage and is now ready for mass production.
Panasonic is said to be considering selling its smartphone business, a report in the Japanese press says. What’s even more interesting is that potential customers are said to be HTC and TSMC.