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Exclusive: realme confirms two different chipsets for the realme 3
There has been a lot of speculation lately about the upcoming realme 3 – and other rumored realme devices that have been showing up in various places online. We can now confirm that there will be at least two realme 3 variants with one using the Helio P70 chipset and another using the P60.
Related: realme C1 (2019) announced
We received the screenshots below from a source and reached out to realme for comment. realme confirmed it has two upcoming devices with those model numbers and chipsets, and also confirmed they are both realme 3 variants and not the rumored realme A1. The company wouldn’t comment further on additional variants or other possible product lines and was remaining tight-lipped about that 48MP camera.
We now know the RMX1821 is the global version and uses the MediaTek Helio P60. Given realme’s product strategy, we expect the RMX1825 with the Helio P70 to be the version destined for India. Both are octa-core MediaTek chipsets manufactured on the 12nm process node with the P70’s Cortex-A73 cluster having a slightly higher clock speed. The screenshots have a 16:9 aspect ratio and also reveal that both variants are using Bluetooth 4.2 if that’s the kind of detail to get you excited.
There’s no official launch date yet for the realme 3, but with MWC 2019 on the horizon and some new rumors pointing to an early March announcement, we won’t have to wait much longer to find out more.