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Galaxy Z Fold 5 and Flip 5 leak may reveal some welcomed specs
- A leaker has provided a few specifications for the Galaxy Z Fold 5 and Flip 5.
- The leak suggests both phones will get a water drop hinge and support IP_8-level waterproofing.
- The leak also claims the gap on the Fold will disappear.
From prototype displays to new hinges, there have been plenty of rumors and leaks surrounding the next Galaxy Z Fold and Flip. The latest leak appears to give us some specifications that would be a welcomed change to both handsets.
The tipster Ice Universe — not the most trustworthy of sources — has tweeted out what could be a few of the specs of the Galaxy Z Fold 5 and the Galaxy Z Flip 5. While these details should be taken with a grain of salt, they are believable.
According to the leaker, both phones could receive the water drop hinge Samsung debuted at CES 2023. The handsets may also boast an IP_8-level of waterproofing and feature new touchscreen technology.
Disclose some Fold5/Flip5 specifications. I mentioned them before, but now I’m putting them together.1. Both Fold5 and Flip5 adopt water droplet hinges and support IPX8 level waterproof.2. The size of Fold5 is only 0.2mm different from that of Fold4, which can be almost… https://t.co/yEiPfgYQF1— Ice universe (@UniverseIce) March 19, 2023
Focusing on the Fold, supposedly there will only be a 0.2mm difference in size compared to the Fold 4. However, the outer screen is said to still be 6.2 inches. The leak also claims that the device may weigh as much as 254g, which would be down from the Fold 4’s 263g. More importantly, the Fold 5 may get rid of the pesky gap that plagued the previous iterations.
As for the Flip 5, the leak claims the clamshell foldable could sport an almost square-like outer screen that would be 3.4 inches. Additionally, the inner screen may see a reduction in the screen bezel.
Outside of this leak, rumors have suggested that the handsets could minimize the screen crease due to the new hinges. And both phones are expected to use a Snapdragon 8 Gen 2 or plus variant chipset.