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More UFS 2.0 memory handsets coming as SK Hynix begins production

SK Hynix has begun production of its next generation UFS 2.0 flash memory modules, which will likely end up in future smartphones.

Published onJuly 9, 2015

SK Hynix RAM memory chip

Samsung’s head start with UFS 2.0 memory, the next generation standard for faster NAND flash memory, is to be short lived, as SK Hynix has just begun production of its own memory chips that are destined for smartphones later this year.

The company has stated that talks are ongoing with various global smartphone manufacturers regarding supply of 64GB UFS 2.0 embedded memory modules.

Most current flasgship smartphones make use of eMMC 5.0 or 5.1 memory. SK Hynix’s UFS 2.0 chips can perform 32,000 input/output operations per second for random reading, which is three times faster than eMMC 5.0.

“SK hynix expects mobile devices such as smartphones to enhance their performances with the advanced UFS 2.0,” – Choi Young-joon, SK Hynix VP

The new standard also enables multi-threading of tasks with different priorities, also known as command queuing, and simultaneous data reading and writing. Energy consumption is also reduced compared to eMMC technology, which should help our devices last a little bit longer as well.

Read More: What is UFS 2.0 flash memory?

As with all new technologies, we’re likely to see more high-end device make use of the technology first. Mid-tier and low-end products are expected to begin seeing the technology in gradual phases. IHS Technology researchers believe that UFS will make up 4 percent of mobile embedded memory products this year, 23 percent by 2017 and 49 percent by 2019.