December 23, 2014
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When companies release their flagship devices around the same time every year, we often see leaks and rumors surface a few months beforehand. It’s about that time of year to already start talking about the follow up to HTC‘s most recent flagship, the One M8. We’ve heard a few rumors over the past few weeks about the upcoming flagship, mainly from @upleaks. We’re now hearing yet another update from the leaker, and this time it outs the device’s processor and dimensions.

The new rumor specifies that HTC’s Hima device will use a Qualcomm Snapdragon 810 processor, featuring two separate quad-core processors, clocked at 2GHz and 1.5GHz. The device will measure 144.3 x 69.4 x 9.56 mm. When compared to the One M8, the Hima will be ever-so-slightly smaller according to the leaks.

Although we don’t know how much the device weighs or the materials it’s made with, we do know quite a bit more about the device, according to the rumor. Along with the specs listed above, the device will have a 5-inch 1080p display, 3GB of RAM, a 20.7MP rear-facing camera, either a 13MP or 4MP UltraPixel front camera and a 2840mAh battery. The device will also be available in Gray, Silver, Gold and Gunmetal Gold, and will run HTC’s Sense 7.0 software atop Android 5.0 Lollipop. It’s rumored to launch in March of 2015, so be on the look out for more info on this upcoming HTC flagship.

Now, remember: all of these specifications are rumored, so be sure to take these with a grain of salt. They do, however, all seem like worthy upgrades to the One M8’s current specifications. Overall, how do you feel about the rumored specs so far? Are these getting you more excited for HTC’s upcoming flagship? Let us know your thoughts!

Jimmy Westenberg
Lover of all things Android, Star Wars, dogs, coffee and music.
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