HUAWEI P8 rumors: 16nm octa-core SoC and dual rear cameras

Some new specifications for the upcoming HUAWEI P8 have been leaked by the Weibo account @Ubuntu团队. Previously, little was known about the flagship P8, other than that it would be launching at an event in London on April 15^th.

According to the social media post, the HUAWEI P8 will indeed make use of the company’s in-house Kirin 930 processor, which will be manufactured using a 16nm process. The Kirin 930 is expected to be an octa-core Cortex-A57 and A53 big.LITTLE SoC complete with LTE connectivity, which is a similar design to Samsung’s and Qualcomm’s high-end 64-bit processors. If true, HUAWEI looks to be the first smartphone company to market with a more efficient 16nm SoC design.

The leak also suggests that the HUAWEI P8 will come with a zirconium oxide porcelain uni-body design and double sided glass. The handset will also be just 6mm thick, a whole 0.5mm thinner than the Ascend P7. However, this design choice may have limited the size of the battery that can fit in the P8. The smartphone is expected to ship with a 2,600mAh battery, which is relatively small by today’s standards.

Furthermore, there is also reference to a dual-camera setup hidden within the text, which may be similar to the technology used in HUAWEI’s new HONOR 6 Plus. Previously HUAWEI had stated that it was looking to bring some cutting edge camera technology to the P8, and a 13MP OIS sensor had also been mentioned in some older rumors.

Combined with previous rumors of a 5.2-inch 1080p display, 3GB of RAM and a fingerprint sensor, the HUAWEI P8 sounds very reasonable for a handset expected to cost just ¥2999 (around $480).