Earlier in the week, rumors about the upcoming Meizu Pro 6 suggested that the handset will arrive with a colossal 6GB of RAM. New official details reveal that smartphone will come with a top of the line processing package too, a custom MediaTek Helio X25 SoC developed exclusively for the phone.
The Helio X25 was unveiled at a MediaTek earlier today, where Meizu bosses confirmed that the upcoming Meizu Pro 6 would have first use of the chip. Meizu will have exclusive access to the processor for several months, after which other companies can purchase the chip. The MediaTek Helio X25 was co-developed with Meizu and aims to boost performance without hitting the handset’s battery life.
The Helio X25 appears to be an over-clocked version of the deca-core Helio X20 that MediaTek unveiled last year. It still features the same tri-cluster CPU configuration, with two heavy lifting Cortex-A72 cores accompanied by two quad-core clusters of lower power Cortex-A53s. However, the X25 sees the A72 cores boosted from 2.3GHz to 2.5GHz, while the Mali-T880MP4 GPU is boosted up to 850MHz from 780MHz as well. So we’re looking at a roughly 10 percent increase in clock speeds across the board.
We’re not sure exactly what energy efficiencies have been made to accommodate these higher clock speeds, as there doesn’t appear to be any mention of a different process to the 20nm manufacturing node used for the Helio X20. Whatever they’ve done, the power draw is said to remain roughly the same as the previous chip.
The Helio X25 also supports up to 25 megapixel camera sensors or dual 13 megapixel cameras, 2K and 4K video support at 30fps, fast charging via Pump Express 3.0+, the newly unveiled Vulkan graphics API, Category 6 LTE network support, and VoLTE.
The Meizu Pro 6 isn’t expected to hit markets until the second half of the year, so we might not see many smartphones making use of the Helio X25 until 2017. Although given the recent announcement, the phone may be closer than we think.