CES2013 - Nvidia Tegra 4 (7)_600px

The new Tegra 4 System on a Chip was just unveiled in Las Vegas, and we have the full rundown here. Along with the new SoC, Nvidia’s boss Jen-Hsun Huang also touted the Icera i500 baseband chip, a reprogrammable LTE chip that will run Tegra 4 devices run on a multitude of LTE networks, and the Shield, Nvidia’s first gaming handheld.

The biggest news of the night is, however, Tegra 4, a name that we are likely to hear a lot in the next year or so. Although Nvidia didn’t supply the full spec sheet for the new Tegra 4, we compiled enough information to make a rather complete picture of the powerful new SoC.

Tegra 4 specs

  • Die-size: 80mm2


  • Built by TSMC
  • Cortex A15
  • 28nm manufacturing process
  • HPL – low-power with high-K metal gate
  • Quad-core + companion core
  • The four “power” cores will run at maximum 1.9Ghz
  • Companion core will run at smaller frequencies and power, but is still a Cortex A15
  • Companion core will not be visible to OS

CES2013 - Nvidia Tegra 4 (5)


  • 72 cores
  • 20x the performance of Tegra 2, 6x over Tegra 3
  • Shaders are not unified
  • Direct3D 11 and OpenGL 4.0

Tegra 4 icera i500 die shot


  • Dual channel


  • Full 1440p
  • VP8 acceleration
  • 2560 x 1440 encode/decode


  • 2560 x 1600 24b
  • 1080 @ 120Hz
  • 4K recording
  • DSI 8 Lanes
  • High-speed HDMI
  • Dual display

CES2013 - Nvidia Tegra 4 (12)


  • Super speed imaging: >350MP/sec


  • USB 3.0
  • UART, SDIO, I2S, I2C
  • Designed for phones, smartphones, laptops
  • dual-display output over HDMI
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