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(Update: full body schematics) Purported HUAWEI Ascend P8 images leak out ahead of April press event

Two alleged images of the HUAWEI Ascend P8 have leaked out, revealing the bottom edge of the device.

Published onMarch 23, 2015

huawei logo mwc 2015 3

Update, March 23: @Onleaks has shared a new shot allegedly showing schematics of the Ascend P8. The schematics reveal what appears to be a rectangular fingerprint sensor on the back and a body thickness of just 6.6 millimeters.

ascend p8 schematics

Original post, March 20:

The next big smartphone announcement of 2015 will probably be Huawei’s Ascend P8, which is assumed to be announced at the company’s April 15th press event in London. We don’t know anything about the handset for sure, but we have heard a handful of interesting rumors about the device regarding its cameras, processor, screen size, battery capacity and more. As for the device’s aesthetics? Thanks to a few recently-outed images, we might have a good idea as to what the new smartphone will bring to the table.


The first notable image we should talk about is the most recent leak from @OnLeaks. Just yesterday, the leaker outed a single picture of what’s purported to be the P8’s backside. More specifically, the image gives us a look at the bottom edge, which features a pretty standard layout. All we’re seeing is a Micro USB port flanked by two speaker cutouts. The device looks to be mostly made of a type of metal, though the picture is quite fuzzy, so it’s a little difficult to tell.


The next image comes to us from another leaker on Twitter. The new image gives us a better look at the phone’s bottom edge. We’d be lying if we didn’t see some design queues taken from the Samsung Galaxy S6 or the iPhone 6, but there’s really only so much manufacturers can do when the edges are made of metal. The smartphone in the image is surrounded by a protective case. Even so, judging by this image, the phone’s chassis looks thin. If both of these leaks are accurate, the P8 is shaping up to be one attractive device.

So far, the HUAWEI Ascend P8 rumors have been suggesting the device will come with a 5.2-inch full HD display, a 64-bit octa-core Kirin 930 CPU, 3GB of RAM, 32GB of on-board storage, a 13MP OIS rear-facing camera and a 2,600mAh battery. A few more rumors have also suggested that it will only be 6mm thin, which is a whole 0.5mm thinner than the Ascend P7.

Again, these are all just rumors for now, so be sure to take all of this with a grain of salt. But if the rumored specifications and the above images prove to be true, could the HUAWEI Ascend P8 be a contender for your next smartphone?

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