Just yesterday we took a look at Crossbar’s new technology to improve mobile memory storage, but Samsung has already moved into mass production of its new technology, which the company calls V-NAND flash.
After nearly 10 years of research, Samsung has managed to bypass the problems with scaling up traditional NAND flash chips by moving into the 3D realm. Rather than simply putting memory cells on a single 2D plane, the company has supped up its Charge Trap technology to build cell structures in 3D, aka vertical NAND (V-NAND).
So whilst Samsung’s new flash memory is just a sequential improvement on the existing setup, it does offer a couple of benefits over existing technologies. Firstly, Samsung states that its new memory chips will be at least twice as reliable as its older versions, possibly offering up to 10 times the reliability, but this will probably vary depending on the side of the memory chip.
These V-NAND flash chips will offer Samsung’s 128-gigabit (16GB) capacity, which is currently the densest flash memory on the market. What this means is that Samsung can build denser memory chips than ever before, thanks to the vertical plain, increasing the storage capacity of memory cards and solid state hard drives without taking up much more space or limiting reliability.
Samsung currently hasn’t specified when its new technology will hit the market, so we’ll have to wait and see which device will be the first to ship with this new storage solution.
Represents a breakthrough in overcoming NAND scaling limit; ushers in new 3D memory era
SEOUL, South Korea–(BUSINESS WIRE)–Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first three-dimensional (3D) Vertical NAND (V-NAND) flash memory, which breaks through the current scaling limit for existing NAND flash technology. Achieving gains in performance and area ratio, the new 3D V-NAND will be used for a wide range of consumer electronics and enterprise applications, including embedded NAND storage and solid state drives (SSDs).
“Following the world’s first mass production of 3D Vertical NAND, we will continue to introduce 3D V-NAND products with improved performance and higher density, which will contribute to further growth of the global memory industry.”
Samsung’s new V-NAND offers a 128 gigabit (Gb) density in a single chip, utilizing the company’s proprietary vertical cell structure based on 3D Charge Trap Flash (CTF) technology and vertical interconnect process technology to link the 3D cell array. By applying both of these technologies, Samsung’s 3D V-NAND is able to provide over twice the scaling of 20nm-class* planar NAND flash.
“The new 3D V-NAND flash technology is the result of our employees’ years of efforts to push beyond conventional ways of thinking and pursue much more innovative approaches in overcoming limitations in the design of memory semiconductor technology,” said Jeong-Hyuk Choi, senior vice president, flash product & technology, Samsung Electronics. “Following the world’s first mass production of 3D Vertical NAND, we will continue to introduce 3D V-NAND products with improved performance and higher density, which will contribute to further growth of the global memory industry.”
For the past 40 years, conventional flash memory has been based on planar structures that make use of floating gates. As manufacturing process technology has proceeded to the 10nm-class* and beyond, concern for a scaling limit arose, due to the cell-to-cell interference that causes a trade-off in the reliability of NAND flash products. This also led to added development time and costs.
Samsung’s new V-NAND solves such technical challenges by achieving new levels of innovation in circuits, structure and the manufacturing process through which a vertical stacking of planar cell layers for a new 3D structure has been successfully developed. To do this, Samsung revamped its CTF architecture, which was first developed in 2006. In Samsung’s CTF-based NAND flash architecture, an electric charge is temporarily placed in a holding chamber of the non-conductive layer of flash that is composed of silicon nitride (SiN), instead of using a floating gate to prevent interference between neighboring cells.
By making this CTF layer three-dimensional, the reliability and speed of the NAND memory have improved sharply. The new 3D V-NAND shows not only an increase of a minimum of 2X to a maximum 10X higher reliability, but also twice the write performance over conventional 10nm-class floating gate NAND flash memory.
Also, one of the most important technological achievements of the new Samsung V-NAND is that the company’s proprietary vertical interconnect process technology can stack as many as 24 cell layers vertically, using special etching technology that connects the layers electronically by punching holes from the highest layer to the bottom. With the new vertical structure, Samsung can enable higher density NAND flash memory products by increasing the 3D cell layers without having to continue planar scaling, which has become incredibly difficult to achieve.
After nearly 10 years of research on 3D Vertical NAND, Samsung now has more than 300 patent-pending 3D memory technologies worldwide. With the industry’s first completely functional 3D Vertical NAND memory, Samsung has strengthened its competitiveness in the memory industry as well as set the foundation for more advanced products including one terabit (Tb) NAND flash, while setting a faster pace for industry growth.
According to IHS iSuppli, the global NAND flash memory market is expected to reach approximately US $30.8 billion in revenues by the end of 2016, from approximately US $23.6 billion in 2013 with a CAGR of 11 percent, in leading growth of the entire memory industry.
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wouldnt care if its horizontal, diagonal or vertical, as long as they give me moar for less :P
384 gig Note III … YEAH BABY!
yea old days are back again.. Thankyou Samsung for being woken up late, atleast u did with the fear of competition
I just wish Samsung would get the price right. All 3D stacked silicons chips are extremely expensive.
… because chips have never had multiple layers before… #Marketing.
Oh, come on, they made these chips just because TouchWiz needs MOOOOORE storage