Rumor: Liquidmetal tech in the cards for future HTC smartphones
A new report from Taiwan says that HTC may be interested in using Liquidmetal technology in its future smartphones.
The news comes from DigiTimes, but we’ll advise you to take it with a grain of salt as nothing is confirmed at this time.
HTC is said to work with Jabon International for Liquidmetal chassis supply, which would be used for new devices in the second half of the year, although neither company was willing to comment on the matter.
The Taiwanese smartphone maker is reportedly trying to beat Apple to market with such Liquidmetal-based products according to the publication. HTC has apparently recruited additional R&D for this to work on Liquidmetal products.
Liquidmetal is a relatively new technology and has certain advantages over other metal alloys used in the mobile industry, and it’s expected that more mobile device makers would use the new alloy in future products. Liquidmetal features a “high tensile strength, excellent corrosion resistance, very high coefficient of restitution and excellent anti-wearing characteristics,” as Wikipedia succinctly explains it.
In other words, Liquidmetal could be used to manufacture even more resistant mobile devices, capable to withstand shocks better than current models.
HTC’s current flagship, the One, features an aluminum-based unibody design, which can offer increased protection against drops (see our test drop video below), but it would definitely be interesting to see an HTC handset made out of Liquidmetal.
Assuming this particular rumor will be confirmed in the future, we can only be excited to learn more details about the next HTC flagship smartphone – after all, if Liquidmetal will be used, we expect the device sporting such technology to be a high-end one.
That said, DigiTimes also says that some chassis suppliers are “conservative” about this particular metal alloy:
However, some chassis suppliers are conservative about the idea since Apple currently still has partnership with metal chassis makers such as Catcher Technology, Foxconn Technology and Casetek, while market demand for aluminum-alloy unibody chassis remains strong, indicating that the full adoption of Liquidmetal is unlikely to occur in the short term.
We’ll be back with more details about HTC’s future mobile devices as soon as we have them.