HTC Ville Info Leaks; Sense 4.0, ICS, Qualcomm S4 Onboard

November 11, 2011
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If you think the HTC Rezound already beats the iPhone 4S to a pulp, HTC has another–and probably better–killer smartphone in the works. Codenamed as the HTC Ville, it will be one of the handsets to be unveiled at the  upcoming Mobile World Congress (MWC) 2012.

First reported by Boy Genius Report, the HTC Ville will employ a 1.5-GHz dual-core Snapdragon Series 4 processor, an 8-megapixel camera that is capable of recording 1080p HD video, and a 4.3-inch qHD Super AMOLED display. Support for HSPA+ connectivity is expected and a 1,650-mAh battery will power the device. Yet another feature to look forward to will be Beats audio compatibility.

Due to the metallic design of the case, NFC capability seems unlikely to find its way in the smartphone. And as shown in the leaked image, the HTC Ville may also arrive without a front camera.

Nonetheless, the phone will only be 8.0-mm thick, thinner than the iPhone 4S.  Ice Cream Sandwich is also reported to come preinstalled with the device and not arrive as a future update, a plausible scenario considering the HTC Ville’s spring launch. A likely feature to debut first in the device is the customized Android skin, HTC Sense 4.0.

Looks like a cool HTC smartphone to look forward to, huh?  Too bad it’s only qHD.  But, that could still change, right?

 

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